RF-35 2-Layer PCB Optimal Solution for RF and Microwave Circuits
1.Product Introduction
Taconic's RF-35 organic-ceramic laminate combines woven glass reinforcement with advanced ceramic fill technology to deliver exceptional high-frequency performance. This cost-effective 2-layer PCB material features excellent peel strength, ultra-low moisture absorption, and minimal phase shift - making it ideal for commercial microwave applications requiring reliable signal integrity.
2.Key Technical Features
Stable Dielectric Properties:
Dk: 3.5 @1.9GHz
Df: 0.0018 @1.9GHz
Robust Construction:
41kV dielectric breakdown
UL-94 V0 flammability rating
Dimensional Stability:
CTE: 19/24/64 ppm/°C (X/Y/Z)
3.PCB Construction Specifications
| Specification | Value |
|---|---|
| Base Material | RF-35 |
| Layer Count | 2 |
| Board Dimensions | 239.5mm × 130mm (±0.15mm) |
| Trace/Space | 5/7 mils |
| Min Hole Size | 0.3mm |
| Board Thickness | 0.6mm |
| Copper Weight | 1oz (outer layers) |
| Via Plating | 25 μm |
| Surface Finish | ENIG |
| Silkscreen | None |
| Solder Mask | None |
| Electrical Test | 100% tested |
4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
RF-35 Core - 20mil (0.508 mm)
Copper_layer_2 - 35 μm
5.PCB Statistics:
Components: 18
Total Pads: 98
Thru Hole Pads: 72
Top SMT Pads: 26
Bottom SMT Pads: 0
Vias: 32
Nets: 2
6.Performance Advantages
Cost-competitive alternative for RF designs
Enhanced copper adhesion for rework capability
Superior high-frequency signal integrity
Compatible with standard PCB processes
7.Primary Applications
Cellular infrastructure power amplifiers
Microwave filter networks
RF couplers and passive components
Wireless communication systems
8.Quality Assurance
IPC-Class 2 standards compliance
100% electrical testing
Global manufacturing availability